Low Outgassing PUR Hot Melt Glue Circuit Board Adhesive Precision Application

PUR Hot Melt Glue For Electronics / Electric Pur for phone / Hot melt Glue

Product Descriptions:

BJ1015 is a solvent-free,reactive hot-melt polyurethane (HMPUR). It behaves fast strength built-up and high bonding strength in end, reworkable for repair, This product is specially used for electronics screen and smart wear application,and is an excellent product incomprehensive properties.

✅ Strong & Flexible Bond – Withstands drops and bending without cracking .
✅ Water & Moisture Resistant – Ideal for sealing against sweat or light splashes.
✅ Low Outgassing – Won’t fog up camera lenses or sensors (critical for phones).
✅ Precision Application – Can be applied in thin layers for delicate components.

Characteristics:

BJ1015 showed great and balanced adhesion to PC,ABS, glass, metal and etc.

BJ1015 strength built-up fast, it reaches 1MPa within 20min after bonded.

High cured strength:BJ1015  after cured showed high strength on PC and ABS

both in shear and pulling force.

Re-workable:This product after cured can be re-workable by heat it to certain

temperature,the glue line shows elasticity properties.

Good work ability : BJ1015W can be applied by extruding bead and spray.

Good thermos-stability: This product showed termo-stability during long heat,less

15% increase in viscosity after heated at 110C for 6 hours.

Specification: