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Home > Products >
Hot Melt Glue For Electronics
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Smartphone Polyurethane Bonding Adhesive PUR Hot Melt Glue Used For Electronics
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Automotive Adhesive Glue

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Hot Melt Glue For Electronics

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Smartphone Polyurethane Bonding Adhesive PUR Hot Melt Glue Used For Electronics
  • Name
  • Name
  • Name

Smartphone Polyurethane Bonding Adhesive PUR Hot Melt Glue Used For Electronics

Brand Name: KAWAURA
Model Number: BJ1015
MOQ: 1T
Price: 29-60RMB/PCS
Packaging Details: 30ml/pcs
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
CHINA
Certification:
SGS
Usage:
Electric
Classification:
Hot Melt Adhesives
Type:
Hot Melt Glue
Other Names:
Hot Melt Adhesive,adhesive,Super Glue,Polyurethane,Industrial Adhesive Glue
Color:
White
Product Name:
Adhesive,Widely Used PUR Crystal Clear Hot Melt Adhesive Glue For Sale,pur Hot Melt Glue Laminating Machine
Elongation ASTM638:
>1000%
Highlight:

smartphone Polyurethane Bonding Adhesive

,

smartphone PUR Hot Melt Glue

,

Electronics PUR Hot Melt Glue

Product Description

Polyurethane Hot Melt Glue / PUR Hot Melt Glue / Electric Pur For Phone

 

Product Descriptions:

PUR hot melt glue is the top choice for smartphone and electronics manufacturing, offering unmatched durability, flexibility, and reworkability. Its moisture-curing chemistry makes it ideal for waterproofing, shock absorption, and long-term reliability.

 

Characteristics:

 
BJ1015 showed great and balanced adhesion to PC,ABS, glass, metal and etc.
 
BJ1015 strength built-up fast, it reaches 1MPa within 20min after bonded.
 
High cured strength:BJ1015 after cured showed high strength on PC and ABS
 
both in shear and pulling force.
 
Re-workable:This product after cured can be re-workable by heat it to certain
 
temperature,the glue line shows elasticity properties.
 
Good work ability : BJ1015W can be applied by extruding bead and spray.
 
Good thermos-stability: This product showed termo-stability during long heat,less
 
15% increase in viscosity after heated at 110C for 6 hours.
 
Specification:

 

 

Usage Electric
Elongation ASTM638 >1000%

Open time @23℃

6-8min

 

 
Tags: 

electronics hot melt adhesive  

cell phone adhesive glue  

electronics hot glue

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