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UL94-V0 Grade PUR Hot Melt Adhesive For 5G Communication Applications

UL94-V0 Grade PUR Hot Melt Adhesive For 5G Communication Applications

Brand Name: kawaura
Model Number: UH-0608B
MOQ: 100PCS
Price: Negotiate Price
Packaging Details: 30ml/pcs
Payment Terms: T/T
Detail Information
Place of Origin:
CHINA
Certification:
SGS
Appearance:
Dark Gray/black
Viscosity:
11000±3000Mpa.S(140℃)
Solids Content:
100%
Heat Conductivity Coefficiency:
0.8-1.2 W/m. K (typical 1.0)
UL94 Grade:
UL94-V0
Color:
White
Supply Ability:
500PCS
Highlight:

5G Communication PUR Hot Melt Adhesive

,

UL94-V0 Grade PUR Hot Melt Adhesive

,

UL94-V0 Grade hotmelt adhesive glue

Product Description

PUR-5G / 5G PUR Adhesive / 5G Communication Applications Adhesive

 

Descripition:

UH-0608B is a single-component reactive polyurethane adhesive that complies with REACH and UL94 V0 standards.

This product is mainly used for potting and rapid position setting of electronic products, Battery-PCB circuit board protection and heat dissipation. This product exhibits stable performance, superior thermal conductivity and flame-retardant performance while meeting the needs of high-speed production line applications.

 

 

Usage Instructions:

UH-0608B is a one-component thermally conductive flame-retardant PUR adhesive rarely seen in the adhesive industry. In particular, the product has a short solidification time; bonding and demolding can be completed within 20 seconds after potting, and even thick films do not produce bubbles during the curing process. In addition, after fully curing the product can maintain original size under high temperature conditions of 80-120℃, with no warping or bubbling phenomenon. Besides fast potting and fast bonding to substrates.

 

Specification:

Appearance dark gray/black
Solids Content 100%
Heat Conductivity Coefficiency 0.8-1.2 W/m. k (typical 1.0)