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Home > Products >
Hot Melt Glue For Electronics
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Beige Electronics Hot Melt Adhesive Glue PCB Component Glue High Strength
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Beige Electronics Hot Melt Adhesive Glue PCB Component Glue High Strength
  • Name

Beige Electronics Hot Melt Adhesive Glue PCB Component Glue High Strength

Brand Name: KAWAURA
Model Number: BJ1015
MOQ: 50PCS
Price: 40-60RMB/PCS
Packaging Details: 30ml/pcs
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
CHINA
Certification:
SGS
(Viscosity@150 OC):
3000±1000cps
Appl. Temp:
110℃
Color:
Beige
GB/T528-2009:
10MPa
ABS-ABS （GB/T528-2009:
8MPa
Elongation ASTM638:
>1000%
Open Time @23℃:
6-8min
Color:
White
Supply Ability:
3T
Highlight:

Beige Electronics Hot Melt Adhesive Glue

,

PCB Component Glue High Strength

,

Beige PCB Component Glue

Product Description

Electric Pur Hot Melt Glue / PUR Hot Melt Glue For Electronics / PUR Electronics

 

Product Descriptions:

BJ1015 is a solvent-free,reactive hot-melt polyurethane (HMPUR). It behaves fast strength built-up and high bonding strength in end, reworkable for repair.

Applications in Electronics:

  • PCB Component Fixation – Secures connectors, capacitors, and wires before soldering.

  • Wire Strain Relief – Prevents cable breakage at solder points.

  • Enclosure Sealing – Protects sensitive electronics from dust/moisture ingress.

  • Display & Touch Panel Assembly – Bonds layers without outgassing (unlike silicones).

  • Battery Pack Assembly – Provides structural support and vibration resistance.

 

Characteristics:

BJ1015 showed great and balanced adhesion to PC,ABS, glass, metal and etc.

BJ1015 strength built-up fast, it reaches 1MPa within 20min after bonded.

High cured strength:BJ1015 after cured showed high strength on PC and ABS

both in shear and pulling force.

Re-workable:This product after cured can be re-workable by heat it to certain

temperature,the glue line shows elasticity properties.

Good work ability : BJ1015 can be applied by extruding bead and spray.

Good thermos-stability: This product showed termo-stability during long heat,less

15% increase in viscosity after heated at 110C for 6 hours

 

 

 

Specification:

(Viscosity@150 oC) 3000±1000cps
Appl. Temp 110℃
Open time @23℃ 6-8min

 

Tags: 

electronics hot melt adhesive  

cell phone adhesive glue  

electronics hot glue

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