Moisture Curing PUR Adhesive Glue For Electronics Chemical Resistant / PUR for circuit board

Moisture Curing PUR Adhesive Glue For Electronics Chemical Resistant / PUR for circuit board

Product Descriptions:

PUR (Polyurethane Reactive) hot melt glue is a specialized adhesive increasingly used in electronics and phone

• Superior bonding strength - forms durable, flexible bonds with various materials

• Moisture curing - reacts with ambient humidity to create strong cross-linked bonds

• Heat resistance - maintains integrity in high-temperature environments

• Chemical resistance - withstands exposure to solvents and other chemicals

• Low application temperature (typically 120-140°C) reduces thermal stress on components

manufacturing due to its unique properties.

Characteristics:

BJ1015 showed great and balanced adhesion to PC,ABS, glass, metal and etc.

BJ1015 strength built-up fast, it reaches 1MPa within 20min after bonded.

High cured strength:BJ1015  after cured showed high strength on PC and ABS

both in shear and pulling force.

Re-workable:This product after cured can be re-workable by heat it to certain

temperature,the glue line shows elasticity properties.

Good work ability : BJ1015W can be applied by extruding bead and spray.

Good thermos-stability: This product showed termo-stability during long heat,less

15% increase in viscosity after heated at 110C for 6 hours.

Specification: